High-Speed 3D Vision, Built Into a Single Chip
The performance of high-speed 3D vision ultimately depends on how well the algorithm and the silicon can be aligned with each other.
SYNMEWON has worked from the ground up from the start: replacing conventional FPGA architectures with our own ASIC, putting algorithmic capability directly into silicon. Our product forms include processing chips, modules and complete systems, all three built on one shared underlying technology platform.
The algorithm defines how the world is sensed; the chip determines the speed, power and stability with which that approach is delivered. And a good product has to be proven in the global market — once overseas customers are running it and international peers have genuinely benchmarked against it, it has earned its place.
Today, the SYNMEWON official channel goes live.
What We Do
SYNMEWON delivers chip-level solutions for high-speed 3D visual sensing.
Our core work can be stated simply: we put algorithmic capability directly into our own silicon, so that sensing and processing that previously depended on board-level architectures are completed efficiently inside the chip. Our product forms include processing chips, modules and complete systems, all three built on one shared underlying technology platform.
Our team covers the full development chain, from algorithm definition through to chip realisation. We build our core technology in-house, and we design to global standards.
Company Overview
Headquartered in Suzhou Industrial Park, with a branch in Xi'an. Suzhou keeps us close to the industrial cluster and to customer sites; Xi'an serves as our second hub for talent and technology, with long-standing and deep cooperation with local universities.
Technology Roadmap
SYNMEWON works in parallel on two technology routes — structured-light measurement and spectral measurement — and has built a unified sensing platform on top of them, enabling technology reuse from chip to module to complete system.
The two routes have different strengths and complement each other: the first targets measurement speed and accuracy, the second targets the complex conditions created by varying materials and environments. Together they cover a wider range of applications. The value of a platform approach is that one underlying technology can give rise to multiple product forms.
Application Areas
Our products serve four application areas with demanding sensing requirements:
-
Industrial inspection
In-line measurement and defect recognition on production lines, with faster measurement and higher accuracy.
-
Medical optics
Underlying support for high-precision optical sensing.
-
Commercial aerospace
Stable, reliable sensing in the space environment.
-
Embodied AI
Real-time, usable visual perception for robots.
These four areas set strict requirements for real-time performance and stability, and they are where our in-house silicon brings the most concentrated advantage. Our plan is to make the products solid in these demanding areas first, then extend laterally.
Development Progress
To date, we have completed two 28nm MPW tape-out validations with a domestic foundry partner, and front-end design for a third MPW is nearing completion. From algorithm definition and chip architecture design through to wafer bring-up and validation, we have worked through the entire flow, with each essential stage completed by our own team.
What this means is that the high-speed 3D vision sensing chain no longer depends on assembling purchased off-the-shelf solutions. It runs on our own silicon.
Along this chain, we have built up corresponding technical assets and qualifications:
- 20+ invention patent applications filed
- 2 integrated circuit layout designs
- 10+ software copyrights
- 1 software product certification
- Certified as a technology-based SME
These are interim results and will be updated as products move into volume production.
What Comes Next
Qualifications are only a starting point. Next, the company will focus on volume production and market deployment, turning technical capability into products we can deliver consistently.
Alongside domestic deployment, we are building international support and certification pathways, and we welcome early conversations with overseas partners.
This channel will keep updating on three fronts: industry developments, product progress and team growth.
Our People, and Open Roles
At SYNMEWON, the company's growth and each person's growth are the same thing.
Chip development has long cycles and a high bar, and personal technical growth needs complete projects to build on. We choose to invest our resources in people first: our engineers take part in the entire chain, from algorithm definition to chip bring-up, and form their own technical judgement through complete projects. What we want colleagues to build here is capability that lasts.
We are assembling a team that supports each other professionally and stays aligned on direction over the long term. As the product moves forward a step, everyone on the team moves forward a step — that is the rhythm we intend to keep. Our view on this sector is a long-term one, and our investment in people is just as long-term.
To apply: hr@xenovis.cn
Contact
Website https://www.synmewon.com
Suzhou HQ Floor 7, Building 11, Suzhou International Science Park Phase V (Creative Industry Park), 328 Xinghu Street, Suzhou Industrial Park, Suzhou, Jiangsu, China
Xi'an Branch Room 801, Building C, Jiaoda Nanyang Times, Yanta District, Xi'an, Shaanxi, China
Business development / Media & Investment marketing@xenovis.cn
Careers hr@xenovis.cn
Closing
There are no shortcuts to building a good product. Every time the algorithm and the silicon are aligned, the result has to be proven by the chip that comes back from the foundry.
We want SYNMEWON's chips to serve not only customers in China but also to run on overseas customers' production lines — and to be part of the global supply chain.
This channel will document each step of the journey.